| PART |
Description |
Maker |
| MF1ICS5005 MF1ICS5005V1D MF1ICS5005W1D |
Standard Card IC Specification “bumped sawn wafer on UV-tape”
|
NXP Semiconductors
Philips Semiconductors
|
| MASW-009276-001DIE |
Bumped GaAs SP3T Switch
|
M/A-COM Technology Solutions, Inc.
|
| 53290-0680 53290-0580 53290-1580 |
2.0mm BTB Conn. Wafer Assy 06 ckt LF 6 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
2.0 BtB Wafer Assy 5Ckt White 5 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
2.0mm BTB Conn. Wafer Assy 15 ckt LF
|
Molex, Inc.
MOLEX INC
|
| 55659-1819 55659-1219 55659-3619 55659-2019 |
Mini Mi2 2-Row Relay Wafer Assy 18Ckt 18-18 CONTACT(S), MALE-MALE, PANEL MOUNT, PCB ADAPTER
Mini Mi2 2-Row Relay Wafer Assy 12Ckt 12-12 CONTACT(S), MALE-MALE, PANEL MOUNT, PCB ADAPTER
Mini Mi2 2-Row Relay Wafer Assy 36Ckt 36-36 CONTACT(S), MALE-MALE, PANEL MOUNT, PCB ADAPTER
Mini Mi2 2-Row Relay Wafer Assy 20Ckt 20-20 CONTACT(S), MALE-MALE, PANEL MOUNT, PCB ADAPTER
|
Molex, Inc.
|
| 5289-5A 10311028 0010311028 0010311048 0010311068 |
KK 5/7.5 WAFER ASSY WITH LOCK
|
Molex Electronics Ltd.
|
| IRGC100B120KB |
Die in Wafer Form
|
International Rectifier
|
| CSPNL |
Wafer Level Packaging
|
Amkor Technology
|
| FD200H06A5B |
Fred Die in Wafer Form
|
International Rectifier
|
| HF51C120ACE |
Hexfred Die in Wafer Form
|
International Rectifier
|
| HF20A060ACE |
Hexfred Die in Wafer Form
|
IRF[International Rectifier]
|
